Fast curing adhesive bonds SMDs on to circuit boards

9th November 2017
Posted By : Alice Matthews
Fast curing adhesive bonds SMDs on to circuit boards

Global supplier of industrial RTV silicones, adhesives, sealants, encapsulants, conformal coatings, tapes, casting and mould making materials, Techsil, has launched a new fast curing epoxy adhesive Structalit 5610 from manufacturers Panacol. This adhesive is specially designed for bonding Surface Mounted Devices (SMDs) on to circuit boards. Due to its high viscosity the adhesive is well-suited for screen printing.

Structalit 5610 is a red-coloured epoxy adhesive which makes a suitable contrast to green circuit boards. The one-component adhesive is easily applied via dispenser, screen printing or needle transfer.

The SMD adhesive cures thermally within minutes, even at low temperatures. At the same time it is highly temperature-resistant: Temporarily it can be exposed to temperatures up to 280°C, making it a suitable adhesive for reflow soldering.

Once cured, Structalit 5610 is shock-resistant and features high adhesion to FR4 circuit boards, to metals and to epoxy-based mould materials.


You must be logged in to comment

Write a comment

No comments

Sign up to view our publications

Sign up

Sign up to view our downloads

Sign up

Medical Japan 2018
21st February 2018
Japan INTEX Osaka
Mobile World Congress 2018
26th February 2018
Spain Barcelona
embedded world 2018
27th February 2018
Germany Nuremberg
Industry 4.0 Summit 2018
28th February 2018
United Kingdom Manchester
Factories of the Future Expo 2018
28th February 2018
United Kingdom Manchester