The introduction of Sarcon YR‐c by Fujipoly gives electronic packaging engineers an unprecedented level of performance from a thin film, thermal interface product. The new formulation delivers a thermal conductivity of 4.0 W/m°K with a thermal resistance of only .08°Cin2/W.
When placed between a heat source such as a high‐performance semiconductor and a nearby heatsink, the Sarcon YR‐c effectively eliminates near‐microscopic air gaps that exist between the components. By increasing surface area contact it is possible to measurably improve the cooling performance of the heatsink.
This V‐0 rated thin film is recommended for applications with operational temperatures that range from ‐40°C to +150°C. Sarcon YR‐c is available in thicknesses of 0.2, 0.3, and 0.45mm. It can be ordered in roll form up to 150mm wide or can be die‐cut to your exact specification requirements.