High performance thermal interface thin film

2nd March 2016
Posted By : Peter Smith
High performance thermal interface thin film

The introduction of Sarcon YR‐c by Fujipoly gives electronic packaging engineers an unprecedented level of performance from a thin film, thermal interface product. The new formulation delivers a thermal conductivity of 4.0 W/m°K with a thermal resistance of only .08°Cin2/W.

When placed between a heat source such as a high‐performance semiconductor and a nearby heatsink, the Sarcon YR‐c effectively eliminates near‐microscopic air gaps that exist between the components. By increasing surface area contact it is possible to measurably improve the cooling performance of the heatsink.

This V‐0 rated thin film is recommended for applications with operational temperatures that range from ‐40°C to +150°C. Sarcon YR‐c is available in thicknesses of 0.2, 0.3, and 0.45mm. It can be ordered in roll form up to 150mm wide or can be die‐cut to your exact specification requirements.  

You must be logged in to comment

Write a comment

No comments

More from Fujipoly America Corp.

Sign up to view our publications

Sign up

Sign up to view our downloads

Sign up

Hotspots Specials 2019
24th October 2019
Germany Böblingen, Germany
IoT Solutions World Congress 2019
29th October 2019
Spain Barcelona
Maintec 2019
30th October 2019
United Kingdom NEC, Birmingham
NOAH Conference 2019
30th October 2019
United Kingdom Old Billingsgate, London
productronica 2019
12th November 2019
Germany Messe München