Highly-compressible TIM guarantees thermal stability up to 400°C

Posted By : Alice Matthews
Highly-compressible TIM guarantees thermal stability up to 400°C


Distributor Rutronik has presented a highly-compressible Thermal Interface Material (TIM) from Panasonic, the Soft-PGS. Its 200µm thickness guarantees thermal stability up to 400°C with thermal conductivity up to 400W/mK. Soft-PGS is a 200µm thick graphite sheet designed for use as a thermal interface material for IGBT modules.

It reduces contact thermal resistance between rough surfaces in thin spaces and enhances the thermal coupling between heat producing devices (heat sources), such as IGBT modules, and heat dissipation devices (heat sinks). It features thermal stability of up to 400°C and high reliability against intense heat cycles (-55 to 150°C).

Its thermal conductivity is guaranteed at 400W/mK for X-Y direction and at 30W/mK in Z direction. This thin Soft-PGS sheet is easy to install, and has far lower labour and installation costs compared to thermal grease or phase change material. A wide range of standard sheets for different IGBT modules from various suppliers is available at Rutronik.

Downloads


You must be logged in to comment

Write a comment

No comments




More from Rutronik Elektronische Bauelemente GmbH

Sign up to view our publications

Sign up

Sign up to view our downloads

Sign up

Hotspots Specials 2019
24th October 2019
Germany Böblingen, Germany
IoT Solutions World Congress 2019
29th October 2019
Spain Barcelona
Maintec 2019
30th October 2019
United Kingdom NEC, Birmingham
NOAH Conference 2019
30th October 2019
United Kingdom Old Billingsgate, London
productronica 2019
12th November 2019
Germany Messe München