Photoresist for MEMS and wafer-level packaging
Engineered Material Systems has introduced the DF-3520 dry-film negative photo resist for use in micro-electro mechanical systems (MEMS), wafer-level packaging and CMOS applications (TSV sealing). This material formulation has been optimized for hot roll lamination and processing on MEMS and IC wafers.
DF-3520 is available in other thickness formats from 5 to 50 µm, ±5 percent. The cured chemistry can withstand harsh environments including resistance to extreme moisture conditions and corrosive chemicals.
The DF-3520 film is tougher (less brittle) than most negative photo resists on the market with a glass transition temperature of 154°C (by DMA Tan Delta) and a moderate modulus of 3.25 GPa at 25°C. It is hydrophobic in nature, providing chemical and moisture resistance. DF-3520 is compatible with and can be used in contact with the EMS line of spin-coatable photoresists.
DF-3520 is the latest addition to Engineered Materials Systems’ full line of film and liquid negative photo resists formulated for making microfluidic channels on MEMS devices and integrated circuits.
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Panasonic PhotoMOS® Photovoltaic MOSFET High-Power Drivers
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| Cost: | $3.95 |
