Fujipoly has introduced high-performance, glass fabric reinforced thermal interface materials designed to deliver high thermal conductivity (3.0 W/m°K) while exhibiting a thermal resistance as low as .17°Cin2/W.
According to Fujipoly, Sarcon GAR reinforced film is ideal for complex die-cut shapes and exerts a low force on components as it fills near‐microscopic air gaps between the heatsink and board-level heat sources. This dramatically increases surface contact and measurably improves the cooling performance of the heatsink.
Fujipoly’s V‐0 equivalent thin film is recommended for applications with operational temperatures that range from ‐40°C to +150°C. Sarcon GAR comes in three thicknesses (0.2, 0.3, and 0.45mm) and is offered in rolls, pre-cut sheets or can be die-cut to the exact shape you need.