Solder paste said to deliver superior ICT performance

12th April 2016
Posted By : Peter Smith
Solder paste said to deliver superior ICT performance

Indium Corp has released Indium10.2HF, a halogen and Pb-free, no-clean solder paste that has been specifically formulated to address in-circuit testing challenges. Indium10.2HF is said to provide low cost-of-ownership to PCB assemblers through all-around balanced performance. 

In addition to outstanding print transfer for increased yields, and resistance to head-in-pillow (HIP) and non-wet open (NWO) defects, this no-clean solder paste is ideal for customers who want a clear residue that quickly breaks away after in-circuit testing. Indium10.2HF also helps to Avoid the Void™ by delivering low voiding in QFNs, BGAs, and CSPs.

This solder paste is perfectly suited for a variety of printing applications, even with small components. It also has superior HIP and NWO resistance, slump resistance, and ICT/flying probe testability. Indium10.2HF solder paste is part of Indium Corporation’s family of high-performance, lead-free, low-voiding, no-clean solder pastes that help manufacturers Avoid the Void.

 

 

 

 


You must be logged in to comment

Write a comment

No comments




Sign up to view our publications

Sign up

Sign up to view our downloads

Sign up

productronica 2019
12th November 2019
Germany Messe München
SPS IPC Drives 2019
26th November 2019
Germany Nuremberg Messe
Vietnam International Defense & Security Exhibition 2020
4th March 2020
Vietnam National Convention Center, Hanoi