Thermal interface material offers 2.5W/m°K conductivity
Manufactured in a versatile sheet form to be die cut or trimmed to perfectly fit application requirements, the Sarcon PG25A thermal interface material has been introduced by Fujipoly. The extremely soft, gel like compound provides a thermal conductivity of 2.5W/m°K with a thermal resistance of 0.24-1.7°Cin2/W, depending on sheet thickness and compression.
A very low compression force makes the high-performance material suitable for delicate components and vibration absorption. PG25A will quickly conform to all gaps, peaks and air pockets in order to create a large, level surface area contact point when placed on top of uneven components. This high degree of physical contact allows the heatsink to remove unwanted heat more efficiently.
The Sarcon PG25A thermal interface material operates over a temperature range from -40 to +150°C and is available in nine thicknesses from 1.0 to 5.00mm.
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Panasonic PhotoMOS® Photovoltaic MOSFET High-Power Drivers
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