Component Management

Thermally conductive compound for high-end electronics

24th October 2017
DOW
Peter Smith
0

Dow Corning’s TC-5888 thermally conductive compound has been tailored to address the design and manufacturing challenges associated with high-performance server applications. It is said to offer the highest bulk thermal conductivity in Dow Corning’s thermally conductive compound product portfolio with a combination of high thermal conductivity (5.2 W/m.K) along with its ability to achieve thin bond line thickness (BLT) of approximately 20 microns yields low thermal resistance of 0.05 (C.cm2/W). 

The end result is a thermal compound that efficiently dissipates heat to improve performance and reliability of high sensitive server processors. The TC-5888 thermal compound also features what the company says are unique rheological properties that limit its flow beyond a target interface once assembled. This flow characteristic distinguishes it from lower viscosity thermal compounds, and provides greater control for applications requiring a thicker thermal compound layer or greater precision when dispensing compound between surface interfaces – such as in between large server packages and corresponding heat sinks. TC-5888 Thermally Conductive Compound also offers low volatile content vs. competitive thermal compounds, allowing for more consistent rheology, application repeatability and easier screen printing overall.

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