Techsil have introduced 2 new one-component thermal interface materials to the electronics market. While fans, heat sinks, and even liquid cooling and thermoelectric devices can be used to provide enough cooling power, the problem remains to get the heat from the hot components into the cooling hardware. Thermal Interface Materials (TIMs) are designed to fill in air gaps and microscopic irregularities, resulting in dramatically lower thermal resistance and thus better heat dissipation and cooling.
Techsil TIM11021 is a 1-part grey paste silicone non-curing compound that provides high thermal conductivity with low bleed and minimal weight loss at elevated temperatures; successfully operating at a wide temperature range of -40°C to 150°C with a thermal conductivity of circa 2.1W/mK. TIM11021 is designed to withstand hydraulic ‘pump out’ caused by thermal cycling. It has minimal ionic impurities and is used across a range of industries including thermal management, aerospace & aviation, automotive, healthcare and power supplies.
Techsil TIM11123 (GB) is a self-gapping, non-corrosive, 1-part, room temperature vulcanising (RTV) silicone rubber. TIM11123 cures rapidly in contact with atmospheric moisture to a tough rubber that exhibits an excellent thermal conductive property of circa 2.3 W/mK.
TIM11123 (GB) does not corrode copper or its alloys and offers excellent primerless adhesion to many substrates when fully cured. It has been designed to be flowable and contains 200 micron glass beads to control bond line thickness. Adhesive TIM11123 (GB) presents good spreading and tooling properties with low linear shrinkage and fast skinning. It will cure through 2 to 3mm in less than 24 hours and its adhesion to most substrates improves with age until most are cohesive.
Both TIM11021 & TIM11123 (GB) are supplied ready to use in 310ml cartridges, no mixing is required reducing wastage and making the product very easy to apply. They can be dispensed using either manual or pneumatic dispensers.