Altium just announced its first annual PCB design conference created to help engineers grow their design expertise and contribute to the advancement of the electronics design community. According to the company, “AltiumLive 2017: Annual PCB Design Summit” will grant attendees the opportunity to learn new skills, interact with like-minded engineers, and get inspired to design next-generation electronics from industry icons and design masters.
“AltiumLive 2017: Annual PCB Design Summit” has been designed specifically for those who want to expand their engineering knowledge and design skills with two days of live workshops, professional development courses, and more. Also featured will be industry keynotes from leading authority on HDI technology and former GENTEX CTO Happy Holden, esteemed signal integrity expert and former Senior Principal Engineer of L-3 Avionics Systems Rick Hartley, and high-speed design authority Lee Ritchey of Speeding Edge. With courses that cover specific solutions to common design challenges, attendees will learn tips and tricks to help them achieve success through each stage of the design process, from concept to manufacturing. Designers at top technology companies around the world will share their unique insight into best practices for successful PCB design.
AltiumLive 2017 attendees will also have the opportunity to experience upcoming Altium product releases before they become available worldwide, including highly-anticipated solutions Altium Designer 18 and ATINA. Technical experts from the Altium Research & Development team will be on site to answer questions and provide insights on the Altium toolset while giving live demonstrations of several exciting new technologies.
Additionally, conference attendees can discover a wide range of new solutions from Altium partners in the Technology Expo. Altium partners interested in exhibiting at the Technology Expo can get more information by sending an email to email@example.com.
Registration for “AltiumLive 2017: Annual PCB Design Summit” is now open with locations in Europe and North America. The North American event will take place in San Diego, California on October 3rd and 4th, 2017, while the European event will be held in Munich, Germany on October 24th and 25th, 2017. Due to the limited space of the event, early registration is encouraged for anyone interested in attending. Early bird pricing is available until August 15th.