RFI shield cans enhance board level protection
Designed to provide protection for sensitive PCB circuitry against RFI and EMI at board level, the S02 series of low profile RFI shield cans has been released by Harwin. Depending on frequency and configuration, attenuation performance of up to 24dB can be achieved.
An extension to the company’s EZBoardWare range, the devices are designed to be used with EZBoardWare RFI shield can clips and provide protection against vibration due to their retention. These low-profile cans, manufactured from 0.2mm thick nickel silver, can be placed automatically to minimise manufacturing costs. An additional advantage of EZBoardWare RFI shield cans and clips is easy removal and replacement, useful when adjustment, repair and maintenance is required.
The S02 series of RFI shield cans have a simple, five-sided box design, which is mechanically robust and claimed to be more cost-effective than fence and cover types. Used with EZ-BoardWare shield can clips, the devices resist vibration and remain securely retained on the PCB. As well as simplifying maintenance and adjustment, auto placement of both the EZBoardWare shield cans and related EZ-BoardWare clips eliminates post-assembly soldering and de-soldering, significantly reducing PCB damage caused by local overheating on the board.
There are many applications for EZBoardWare RFI shield cans across multiple markets, including consumer electronics and industrial, instrumentation and control systems. Some examples are radio systems, wireless equipment and consumer electronic devices which require high shielding performance and effective can retention at low-cost.
The S02 series cans are available in the following standard sizes: 20x15x3, 25x20x3 and 30x20x2.5mm.
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