Component Management
Thermal behaviour of DC motors
During the continuous operation of DC motors, power losses occur to conserve energy. Ronak Samani, Technical Engineer at maxon UK and Ireland, provides an analytical explanation of the thermodynamic response and details the significance behind the thermal parameters listed in maxon DC motor datasheets.
Targeting net-zero emissions for chip manufacturing
At Future Summits 2022, imec announces that its Sustainable Semiconductor Technologies and Systems (SSTS) research programme succeeded in bringing together stakeholders of the semiconductor value chain, from large system companies such as Apple and Microsoft, to suppliers, including ASM, Kurita, SCREEN and Tokyo Electron.
Helping electric vehicles keep their cool
Packing enough energy into a battery to power a car is putting a lot of pressure on the storage devices that, for the last century or so, have mainly been tasked with running small appliances and electronics.
Latest server processors get embedded support
IT/OT convergence at the edge needs customised server solutions with scalable performance to match individual requirements. Developing such solutions requires embedded support for key hardware components.
Joint process development presentation at SMTconnect
Indium Corporation expert Andreas Karch, Regional Technical Manager and Technologist – advanced applications, and Ralf Sedlatschek, Head of Technology, KATEK Group, will co-present their joint process development on a materials solution to prevent hotspots in thermally-critical components at SMTconnect, May 10, 11:40 a.m.-Noon, Nuremberg, Germany.
Embedded World 2022: A-China Semiconductor Ltd
A-China Semiconductor Ltd is a Hong Kong based fabless semiconductor start-up company. It has successfully developed a 32-bit microcontroller with PUF (physical unclonable function) security function (model MCU007).
POLYN and Fraunhofer join forces for European chip project
POLYN Technology and Fraunhofer Mikroelektronik will develop a special process optimisation as a part of POLYN’s next-generation Neuromorphic Analog Signal Processor (NASP) roadmap.
Evaluating the sustainability of 3D electronics
As electronics are becoming increasingly ubiquitous, there is a clear trend toward greater integration. Rather than simply making space for a rigid 2D circuit board (PCB) within the product, electronic functionality will be either mounted conformally onto surfaces or incorporated within the structural materials.
Infineon's new Battery Management ICs
Infineon's Battery Management ICs offer excellent measurement performance and enable optimised battery lifetime.
MicroEJ breaks electronic dependencies to tackle chip shortage risks
MicroEJ is designed for low-cost and low-power chips used in IoT edge devices from small Cloud-connected sensors to smartwatches to smart appliances.