Soldering

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Hand soldering world champion crowned

Hand soldering world champion crowned
The hand soldering competition from IPC returned to the United States with the first-ever IPC Hand Soldering World Championship and Rework Competition, held at IPC APEX EXPO 2019 in San Diego, California. Contestants representing Britain, China, France, Germany, India, Indonesia, Japan, South Korea, Vietnam and Thailand participated in the event.
6th February 2019

Reduce risk and increase productivity with robotic soldering

Reduce risk and increase productivity with robotic soldering
The global launch of the Robotic Soldering System has been announced by Metcal, with patented Connection Validation (CV) technology and a touchscreen graphical user interface to drastically mitigate the risk of solder joint defects and add productivity to the manufacturers’ soldering process.
31st January 2019

Robotic soldering partnership to fully automate applications

Robotic soldering partnership to fully automate applications
It has been announced that Toshiba Machine partner, TM Robotics, has partnered with ELMOTEC to develop robotic soldering technology using Toshiba Machine robots. The soldering machines allow customers to fully automate soldering applications, increasing efficiency of soldering for electrical and electronic components manufacturing.
7th January 2019


Soldering station offers combined maximum power output of 200W

Soldering station offers combined maximum power output of 200W
The RS Pro dual-channel smart soldering station for use by a wide range of engineering professionals has been unveiled by RS Components (RS). Now shipping at a competitive price of £599.95, it is the first product in the RS Pro range to offer a high-end, two-channel specification.
13th December 2018

Entry-level selective soldering system

Entry-level selective soldering system
Worldwide manufacturer of complete solutions for soldering processes and automated production lines, SEHO Systems, has announced plans to exhibit at SMTA International, scheduled to take place October 16th to 17th, 2018. The company will introduce the new StartSelective, plug-and-produce selective soldering system for those just entering into automated soldering in Booth #423.
2nd October 2018

Intelligent network software ecosystem at SMTAI

Intelligent network software ecosystem at SMTAI
Scheduled to take place 16th to 17th October, 2018 at the Donald Stephens Convention Center in Rosemont, IL, KIC has announced plans to exhibit at SMTA International. The new RPI i4.0 automatic profiling system with network software for real time dashboard, data sharing and traceability storage will be demonstrated in Booth #124.
18th September 2018

Water soluble solder paste launched

Water soluble solder paste launched
It has been announced by SHENMAO America that they are introducing the PF606-PW215 water soluble solder paste. The company offers a full line of water soluble fluxes and solder pastes for SMT and IC packaging applications.
19th July 2018

Hand soldering to be showcased at the SMTA Upper Midwest Expo

Hand soldering to be showcased at the SMTA Upper Midwest Expo
Metcal today announced plans to exhibit at the SMTA Upper Midwest Expo & Tech Forum, scheduled to take place Thursday, 14th June, 2018 at the DoubleTree by Hilton Minneapolis - Park Place in Minneapolis, MN. The company will demonstrate its Connection Validation (CV) Soldering System with new hand-pieces, Digital Hot Air Pencil and Solder Tip Cleaner.
22nd May 2018

Benchtop soldering systems to be showcased at NEPCON China

Benchtop soldering systems to be showcased at NEPCON China
Metcal has announced plans to exhibit in Stand 1F38 at NEPCON China, scheduled to take place 24th to 26th April, 2018 at the Shanghai World EXPO Exhibition & Convention Center. The company will show its Connection Validation (CV) Soldering System with new hand-pieces, Digital Hot Air Pencil, High Thermal Demand solution and Solder Tip Cleaner.
23rd March 2018

Laser soldering alleviates miniaturisation issues

Laser soldering alleviates miniaturisation issues
Packing densities increase on ever smaller electronic assemblies due to technical requirements and possibilities. Accordingly, the requirements imposed on soldering these components become all the more stringent because, for instance, sensitive components have to be protected from great heat effects. Pinpoint-accurate, fast, and definable soldering is necessary. Therefore, EUTECT has been using diode lasers for its customised soldering systems.
22nd November 2017


Soldering documents


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IoT Tech Expo 2019
25th April 2019
United Kingdom Olympia, London
Ceramics Expo 2019
29th April 2019
United States of America International Exposition Center (I-X Center)
PCIM 2019
7th May 2019
Germany Nürnberg Messe
Electronics & Applications 2019
14th May 2019
Netherlands Jaarbeurs Utrecht Hall 7 Jaarbeursplein
Agile for Automotive 2019
15th May 2019
United States of America Detroit, MI