At the IPC APEX EXPO, March 25-27 in Las Vegas, USA, the Balver Zinn Group will exhibit in Booth #2714. Balver Zinn and Cobar company representatives will be on hand to display the company’s OT2 and WW50 solder paste along with the latest solder wire and flux technologies and services.
OT2 is Cobar’s latest halide and halogen free solder paste technology that has been specifically developed to meet continuously increasing customer requirements. The OT2 solder paste’s optimised rosin based chemistry offers the best printing and wetting properties in Pb-free. The solder paste is designed to achieve printing speeds up to 250mm/s for the most demanding throughputs. The combination of solvents and activators used in this paste returns a large process window for the reflow process. High yields can be achieved with fast conveyor speeds and short cycle times.
Also at the show, the Balver Zinn Group will debut the Cobar WW50 water soluble solder paste. The paste is compatible with the following alloys: Sn62, Sn63, SAC305 and SN100C, all with Type 3 powder. The rosinous halide-free nature of WW50 is unique, with paste rheology, solder-ability and water wash-ability conferred by carefully selected surface chemistry and activators. With the new WW50 branded paste, it is possible to print at speeds high enough to meet or exceed the throughput of any SMD line. Furthermore, the residues can be easily removed with de-ionised water.
Additionally, Cobar Solder Products is a supporting sponsor of the third annual IPC APEX EXPO Hand Soldering Competition and IPC World Championship, taking place concurrently with the show.