Desoldering paste reduces risk of board damage

21st January 2015
Posted By : Barney Scott
Desoldering paste reduces risk of board damage

The Balver Zinn Group has announced that its U.S. division, Cobar Solder Products, will highlight the Bi Rework Solder Paste (desoldering paste) in Booth 332 at the IPC APEX EXPO, scheduled to take place 24th to 26th February 2015 at the San Diego Convention Center, California. The paste has been designed for desoldering Pb-free components and is ideal for LED removal.

The RoHS-compliant paste, with a desoldering temperature of 180°C, reduces de-soldering temperatures and times. The halide-free flux reduces the risk of board damage during the desoldering process and is easy to dispense and clean up.

Representatives from Cobar also will highlight the Balver Zinn SN100C lead-free product range with Balver Zinn SN100CS+ as a variant with 250ppm instead of the standard 50ppm Ge. Germanium is an antioxidant that will react metal oxides on the surface of the solder to reduce dross formation.

In addition to the Bi Rework Solder Paste, Balver Zinn and Cobar offer a complete range of solder bar, solder wire, solder flux, gel flux, cleaner and solder paste.


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