Desoldering paste reduces risk of board damage

21st January 2015
Posted By : Barney Scott
Desoldering paste reduces risk of board damage

The Balver Zinn Group has announced that its U.S. division, Cobar Solder Products, will highlight the Bi Rework Solder Paste (desoldering paste) in Booth 332 at the IPC APEX EXPO, scheduled to take place 24th to 26th February 2015 at the San Diego Convention Center, California. The paste has been designed for desoldering Pb-free components and is ideal for LED removal.

The RoHS-compliant paste, with a desoldering temperature of 180°C, reduces de-soldering temperatures and times. The halide-free flux reduces the risk of board damage during the desoldering process and is easy to dispense and clean up.

Representatives from Cobar also will highlight the Balver Zinn SN100C lead-free product range with Balver Zinn SN100CS+ as a variant with 250ppm instead of the standard 50ppm Ge. Germanium is an antioxidant that will react metal oxides on the surface of the solder to reduce dross formation.

In addition to the Bi Rework Solder Paste, Balver Zinn and Cobar offer a complete range of solder bar, solder wire, solder flux, gel flux, cleaner and solder paste.

You must be logged in to comment

Write a comment

No comments

Sign up to view our publications

Sign up

Sign up to view our downloads

Sign up

Girls in Tech | Catalyst | 2019
4th September 2019
United Kingdom The Brewery, London
DSEI 2019
10th September 2019
United Kingdom EXCEL, London
EMO Hannover 2019
16th September 2019
Germany Hannover
Women in Tech Festival 2019
17th September 2019
United Kingdom The Brewery, London
European Microwave Week 2019
29th September 2019
France Porte De Versailles Paris