Solder paste stability provides printing benefits

29th July 2015
Posted By : Mick Elliott
Solder paste stability provides printing benefits

Farnell element14 has introduced LOCTITE GC 10, the first-ever temperature stable solder paste, from Henkel. The paste is stable at 26.5°C for one year and at temperatures of up to 40°C for one month, providing benefits from shipping and receiving as well as printing and reflow.

Performance attributes such as 24-hour abandon times, stabilised and consistent print transfer efficiency, expansion of the reflow process window, more than 95% on-line paste utilisation and significant reductions in solder-related defects are all attributed to the temperature stability of the material.

The results of these advantages are higher yields and more cost effective PCB assembly across logistics and the operation chain.

The product, which has been in development for over four years and tested at nearly 20 manufacturing sites worldwide, has been praised in early tests for the ability to hold jobs on the line for as long as two days with excellent reflow performance even though the paste had been exposed for an extended period of time. The paste also prints well which will significantly reduce paste waste while realising excellent process performance.


You must be logged in to comment

Write a comment

No comments




Sign up to view our publications

Sign up

Sign up to view our downloads

Sign up

European Microwave Week 2018
23rd September 2018
Spain Ifema Feria De Madrid
Connected World Summit 2018
25th September 2018
United Kingdom Printworks, London
IoT Solutions World Congress 2018
16th October 2018
Spain Barcelona
Engineering Design Show 2018
17th October 2018
United Kingdom Ricoh Arena, Coventry
Maintec 2018
6th November 2018
United Kingdom NEC, Birmingham