No-clean solder pastes with low melting point

16th November 2017
Posted By : Peter Smith
No-clean solder pastes with low melting point

Heraeus Electronics showed its range of no-clean soldering pastes with a low melting point at productronica this week. The new F498 product series is said to allow significant cost savings in the soldering process. The soldering pastes are characterized by a low void rate and outstanding wetting properties on a wide range of different surfaces. This reduces the formation of solder balls (mid-chip balling). 

The lower temperature in the reflow process reduces energy consumption, saving energy costs. Low-melting soldering pastes use up to 40 percent less energy, resulting in a corresponding reduction in carbon emissions. Longer cleaning intervals due to the lower temperatures reduce maintenance costs.

There are also other advantages related to the lower temperatures for soldering processes: Up until now, components and circuit boards were subjected to temperatures of around 250°C when using traditional lead-free soldering pastes. Soldering pastes with a low melting point from Heraeus Electronics allow the soldering temperature to be reduced by around 70 to 80°C. Components and circuit boards are subjected to less temperature stress allowing lower-cost components to be used. In addition, these soldering pastes can be used to mount components with lower temperature specifications such as those from optoelectronics or the LED industry.

“Our products are used in sophisticated production environments, and our customers demand durable yet low-cost solutions. We have succeeded in this with our new no-clean soldering pastes. These pastes reduce energy costs, contribute to lower carbon emissions and can be used in more applications,” notes Stefan Merlau, Product Manager at Heraeus Electronics. “Heraeus Electronics is continually growing its product portfolio with the aim of providing materials for all specifications from a single supplier.”

 

 


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