Seminar will focus on solder joint reliability

28th July 2017
Posted By : Peter Smith

Indium Corporation is to partner with 3S Silicon Tech, Inc. to host a technology seminar on solder joint reliability for automotive electronics on Aug. 11 in Taiwan Hsinchu.

Technical experts from both companies will detail high-reliability technology and materials for automorive electronics applications, including:

  • High-reliability alloys and low-tempurature solders
  • Reliable materials for SiP applications
  • Power semiconductor developments and applications in the automotive market
  • Vacuum oven reflow technology and applications

For registration details, contact Tommy at tfan@indium.com.


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