Void reducing solder Pastes at NEPCON South China
Indium Corporation will feature its Indium10.1 and Indium8.9HF solder pastesat NEPCON South China (Aug 30-Sept 1). The company has specifically formulated Indium10.1 solder paste to reduce voiding significantly below the industry average – for improved finished goods reliability.
Indium10.1 delivers robust reflow capabilities and a wide processing window, which accommodates various board sizes and throughput requirements, and minimizes defects.
For a halogen-free option, Indium8.9HF solder paste delivers very low voiding. Its unique oxidation barrier technology makes it perfectly suited for a variety of applications, especially automotive assembly.
In addition to outstanding print transfer and excellent response-to-pause, Indium10.1 and Indium8.9HF both provide excellent pin-in-paste solderability and hole-fill.