Component Management

Void reducing solder Pastes at NEPCON South China

14th July 2016
Peter Smith
0

Indium Corporation will feature its Indium10.1 and Indium8.9HF solder pastesat NEPCON South China (Aug 30-Sept 1). The company has specifically formulated Indium10.1 solder paste to reduce voiding significantly below the industry average – for improved finished goods reliability.

Indium10.1 delivers robust reflow capabilities and a wide processing window, which accommodates various board sizes and throughput requirements, and minimizes defects.

For a halogen-free option, Indium8.9HF solder paste delivers very low voiding. Its unique oxidation barrier technology makes it perfectly suited for a variety of applications, especially automotive assembly.

In addition to outstanding print transfer and excellent response-to-pause, Indium10.1 and Indium8.9HF both provide excellent pin-in-paste solderability and hole-fill.

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