Indium Corporation will chair a special session focusing on void reduction in bottom-terminated components (BTCs) at the SMTA International Conference on Sept. 29 in Rosemont, Ill. Voiding is of critical concern in today's electronics assembly arena, especially in BTCs, due to impacts on electrical, thermal, and mechanical performance.

Indium Corporation’s Sze Pei Lim, Semiconductor Product Manager – Asia, will present at the 13th International Wafer-Level Packaging Conference. Her presentation, System-in-Package (SiP) Assembly vs. Solder Paste Attributes, will address the increased demand for SiP due to the rapid development of Internet of Things (IoT) “smart” devices.

Indium Corporation experts will deliver several technical presentations at the 37th International Electronics Manufacturing Technology and 18th Electronics Material & Packaging Conference (IEMT-EMAP 2016), Sept. 20-22, in Penang, Malaysia.  

Indium Corporation is to feature its reinforced indium and solder alloy fabrications, InFORMS, at IMAPS 49th International Symposium on Microelectronics (Oct. 10-13 in Pasadena). InFORMS is said to provide engineers with an enhanced material for the development of new, or the improvement of existing applications. 

Indium Corporation's reclaim and recycle program is now offering customers credit for their solder pot dross and contaminated solder. Returned solder, used in wave and other soldering processes, can be put through Indium Corporation's state-of-the art electrolytic recycling processes that removes both organic and metallic impurities from contaminated tin-lead and lead-free solder and solder dross.

ITO and IGZO targets are widely used for coating glass and display surfaces. Since not all the material is consumed in the deposition process, Indium Corporation reclaims the unused portions of the targets and any indium left in the deposition chambers or on the equipment.

Indium Corporation will feature its Indium10.1 and Indium8.9HF solder pastesat NEPCON South China (Aug 30-Sept 1). The company has specifically formulated Indium10.1 solder paste to reduce voiding significantly below the industry average – for improved finished goods reliability.

Indium Corporation's indium metal and indium alloy reclaim and recycle program earns customers an enhanced return on used materials. Indium is used extensively in thermal management, low-temperature soldering, and sealing applications and, in many instances, the indium is not fully consumed and can be reclaimed from the process. 

Indium Corporation’s Dr. Ning-Cheng Lee, Vice President of Technology, will chair the professional development course, Materials Considerations for Achieving High Reliability Lead-Free Soldering, at the Electronic Components and Technology Conference (ECTC), on May 31-June 3 in Las Vegas.

According to Indium Corporation, its germanium reclaim and recycle program enables customers to increase their return on materials by providing credit for diverting spent germanium from the waste stream. Germanium, used in things like the production of fiber optic cables, optical lenses and wafers, and catalysts in polyethylene (plastic) production, is typically not completely consumed during the process.

Dr. Lee’s webtorial, Low-Temperature Solders: New Developments and Applications, will cover varieties of low-temperature solders with emphasis on lead-free alloys, their physical, mechanical, and soldering properties, and their applications. It will take place from 1-2 p.m. on May 17 and 19.

Kenneth Thum, Senior Technical Support Engineer at Indium Corporation will present Risk of No-Clean Flux Not Fully Dried Under ComponentTerminations at IPC Thailand on April 26 in Bangkok, Thailand.  Thum’s presentation will discuss a new halogen-free, no-clean SAC solder paste that has been developed to Avoid the Void and to address the reliability issues caused by insufficiently dried or burnt-off flux residue.

Indium Corporation will feature its halogen-free Indium8.9HF no-clean solder paste series at SMT Hybrid Packaging 2016 on April 26-28 in Nuremberg, Germany. The Indium8.9HF Series is specifically formulated to Avoid the Void while delivering high transfer efficiency with low variability. 

Indium Corp has released Indium10.2HF, a halogen and Pb-free, no-clean solder paste that has been specifically formulated to address in-circuit testing challenges. Indium10.2HF is said to provide low cost-of-ownership to PCB assemblers through all-around balanced performance. 

Indium Corporation's new Indium10.8HF is a halogen-free, no-clean solder paste that is formulated to provide industry-leading non-wet open performance on large, high IO electronic packages, such as microprocessors. In addition to its resistance to non-wet opens, Indium10.8HF also delivers a superior oxidation barrier. 

Indium Corporation’s Dr. Ning-Cheng Lee, vice president of technology, will present a two-part workshop at SMT Hybrid Packaging 2016, on April 26-28 in Nuremberg.

Indium Corp says manufacturers no longer have to settle for unacceptable levels of voiding when soldering QFNs, CSPs, or BGAs and will help customers Avoid the VoiD with its void-reducing no-clean solder pastes at IPC APEX Expo.

Indium Corporation will be all over APEX with plans to run its low-voiding solder products “Live@APEX” program in partner booths throughout the show in Las Vegas. “Live@APEX,”  is designed to accurately depict the performance of the company’s materials in real time. The program places Indium Corporation products into live equipment demonstrations around the APEX show floor.

Indium Corporation's Sze Pei Lim, Semiconductor Product Manager for Asia, will present at SEMICON China. Lim’s presentation, No-Clean Material for Advanced Packaging Assembly, will detail how semiconductor-grade, ultra-low residue, no-clean fluxes and solder pastes eliminate the need for multiple cleaning steps in the system-in-package (SiP) assembly process.

Indium Corporation has announced the release of PoP Flux 89LV-P, a bright pink-colored, no-clean, thixotropic flux that helps engineers to Avoid the Void by greatly improving visual inspection to minimize voiding and other defects in package-on-package applications.