Graphene filled epoxy offers thermal conductivity

5th April 2019
Posted By : Alex Lynn
Graphene filled epoxy offers thermal conductivity

The newly introduced EP30NG from Master Bond is a two part epoxy adhesive system developed for applications that require high thermal conductivity. It contains a specialty graphene filler which contributes not only to its high compressive strength, but also to its enhanced dimensional stability. 

EP30NG achieves an extraordinary thermal conductivity of 38.15 BTU•in/(ft2•hr•°F) [5.5 W/(m•K)] at room temperature while its compressive strength measures 22,000-24,000 psi upon cure. It has a low coefficient of thermal expansion of 24 to 26 x 10-6 in/in/°C and exhibits a Shore D hardness of 85 to 95.

Rohit Ramnath, Senior Product Engineer, said: “EP30NG is ideal for bonding applications where some contact pressure can be applied. The minimum bond line thickness is 0.18mm, since graphene nanoparticles tend to agglomerate to form larger particles.” 

This epoxy system is formulated to cure at room temperature or more rapidly at elevated temperatures. Part A has a thick paste consistency and Part B is a low viscosity liquid.

EP30NG bonds well to a variety of substrates including metals, composites, ceramics, glass and many plastics. The service temperature range is -60°F to +300°F. The product is available in 30 cc jar kits, 1/2 pint kits, and pint kits. 

Master Bond EP30NG is a thermally conductive epoxy system containing graphene filler. It is suitable for applications where high thermal conductivity is needed and the small amount of electrical conductivity is not a factor.


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