System for plasma treatment prior to die attach

7th April 2014
Posted By : Nat Bowers
System for plasma treatment prior to die attach

Offering double the capacity and throughput of its predecessor in just 16% more floor space, the FlexTRAK-CDS plasma system has been announced by Nordson MARCH. This high-volume, compact platform with strip processing capabilities is designed for plasma treatment prior to die attach, wire bond, mold encapsulation and underfill.

Plasma treatment removes contamination, etches surfaces to improve adhesion and provides surface activation during electronics manufacturing. Surface activation by plasma treatment can enhance die attach, molding, wire bonding and underfilling by enhancing fluid flow, eliminating voids and increasing wicking speed.

The plasma system's integrated strip handling system delivers rapid and reliable material transfer for a wide range of strip sizes. Processing can be done from most types of magazines and carriers. The patented chamber design and control system enable short plasma cycle times with low overhead, ensuring that throughput is maximised and cost of ownership is minimised. The chamber technology of this platform is exactly the same as the CD platform, easing transition to the CDS platform. The system features a compact footprint of 1119x1286mm (44x51"). The patented plasma chamber delivers a low cost of ownership, treating up to 10 strips per plasma cycle.

James Getty, President, Nordson MARCH, commented: "The strip-handling ability of the FlexTRAK-CDS System offers tremendous flexibility for several applications in backend semiconductor and electronics manufacturing. Our patented plasma technology in our popular FlexTRAK platform, combined with the ability to handle strip-type components, answers our customers' requests for this new capability in plasma treatment."


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