VOICE 2019 opens Call for Papers

The 2019 conference will be held in two new locations – Scottsdale, Arizona, on May 14-15 and Singapore on May 23.

Each year, VOICE offers extensive learning opportunities through activities that include technical presentations, keynote addresses, partners’ expositions and technology kiosks.

The conference brings together semiconductor test professionals representing the world’s leading integrated device manufacturers (IDMs), foundries, fabless semiconductor companies and outsourced assembly and test (OSAT) providers to discuss the latest technology advances, generate new ideas and share best practices.

VOICE attendees have numerous opportunities to network with their peers and colleagues during breaks and social events.

Among the highlights of the upcoming 13^th annual VOICE conference will be a keynote speech at the Arizona event by Dr. Hugh Herr, professor and leader of MIT’s Center for Extreme Bionics. A renowned engineer and biophysicist who lost both of his legs in a climbing incident more than 30 years ago, he believes technologists can and must do better to help people.

Called the “Leader of the Bionic Age” by TIME magazine, Dr. Herr and his team are translating tricks the human body uses to move more efficiently into science and technology that not only gives mobility to those without it, but also enhances and extends capabilities.

“Year over year, VOICE gets bigger and better,” said Steve Elenniss, chairman of VOICE 2019 and a senior staff engineer at Advantest. “The topics addressed reflect the most forward-looking applications and market segments, from bionic prosthetics to automated vehicles, smart data, and 5G. Speakers include Advantest technologists, customers from around the world and our global network of strategic partners to provide a truly all-encompassing perspective.”

The VOICE 2019 call for papers is organized in six technology tracks covering the following topics:

● Device/System-Level Test including specific procedures, multiple-input and multiple-output (MIMO) testing, mmWave, next-generation embedded processors, broadband fiber to the home, testing ICs for autonomous vehicles and multi-chip system-in-package devices.

● Internet of Things (IoT) covering enabling technologies, mobility, 5G communications, wireless technologies, radio frequency (RF), wearable electronics, smart cities/homes, sensors and the tactile internet.

● Test Methodologies involving the supporting standards and protocols, solutions for the latest testing challenges, reducing the cost of test, improving throughput and speeding time to market.

● Hardware and Software Design Integration,to include utilising the latest hardware and software features, test cells and new test system enhancements.

● T2000 platform for testing automotive-related ICs for applications including automotive image sensors/LIDAR; evaluating microcontrollers (MCU) and FPGA devices for automotive and consumer applications; system-level testing; ease-of-use and ease-of-conversion software; and specific methodologies for testing devices such as display drivers, touch embedded semiconductors, CMOS image sensors, PMICs, IoT and RFID chips.

● Hot Topics such as new market drivers and future trends, artificial intelligence, smart data innovation (big data analytics or machine learning), secure ID and cyber security, secure cloud computing and video streaming/telepresence.

Test developers and engineers can submit their abstracts to be presented in either the U.S. or Singapore locations, or both. To be considered, submissions must be received by November 5, 2018. Accepted presenters will be notified in December 2018.