Advantest Europe GmbH

Address:
Stefan-George-Ring 2



81929 München
Germany

Phone: +49-89-99312-131

Fax: +49-89-99312-108

Web: https://www.advantest.com/


Advantest Europe GmbH articles

Displaying 61 - 79 of 79

Mixed-signal channel card aids IoT device testing

A high-resolution, highly accurate mixed-signal channel card has been added to its Wave Scale MX product family by Advantest. It extends the series range in testing analogue-to-digital and digital-to-analogue waveform converters. The Wave Scale MX high-resolution card combines high parallel testing capability with reliable AC and DC performance.
22nd June 2017

Duo partner to develop semiconductor test solutions

Duo partner to develop semiconductor test solutions
Advantest Europe and Nash Technologies have announced a strategic partnership to develop solutions for test of semiconductor devices. Advantest’s SoC market share is growing significantly and customers demand solutions to test their devices on its leading V93000 and T2000 test platforms.
10th May 2017

Semiconductor test conference enters second decade

VOICE, the annual developer conference hosted by semiconductor test equipment supplier Advantest will kick off its second decade with 113 technical presentations, an expanded Technology Kiosk Showcase, and a new technology track. Additionally, VOICE 2017 will include three diverse keynote speakers, a Partners’ Expo, and interactive discussion sessions for users of the V93000 and T2000 SoC test platformsas well as Advantest test cell solutions.  
24th April 2017


Test solutions all set for Penang exhibition

Visitors to SEMICON Southeast Asia can learn about the latest in test equipment solutions by visiting semiconductor test equipment supplier Advantest Corporation's stand. The exhibition takes place at the SPICE Arena in Penang, Malaysia (April 25-27). Advantest is a silver sponsor of SEMICON Southeast Asia.
18th April 2017

Semiconductor test company has a DATE in Lausanne

Semiconductor test equipment supplier Advantest will showcase its CloudTesting Services (CTS) at DATE 2017, the European event for electronic systems design and test. The annual conference, which takes place at the SwissTech Convention Centre in Lausanne, Switzerland (March 28-30) combines a technical program with an international exhibition of electronic design automation and test technologies.
23rd March 2017

VOICE keynotes promise riveting presentations

VOICE, the annual developer conference hosted by leading semiconductor test equipment supplier Advantest will offer three diverse keynote addresses ranging from future trends to cyber security to the global semiconductor industry.
13th March 2017

Test solutions on parade at SEMICON China 2017

A wide variety of test solutions will be displayed by Advantest at the SEMICON China 2017 trade show in Shanghai (March 14-16). Advantest will feature both its newest test solutions and its proven products for the China market under the theme, “Measure the Connected World and Everything in It”.
9th March 2017

Semiconductor test conference opens up registration

Registration has opened for those wishing to attend Advantest’s VOICE 2017 Developer Conference being held in Palm Springs, California, on May 16-17 and Shanghai, China on May 26. Both conferences will feature the theme "Measure the Connected World and Everything in It” as VOICE kicks off its second decade.
10th January 2017

IoT test in focus at SEMICON Japan in Tokyo

A wide range of test solutions for diverse applications throughout the Internet of Things (IoT)will be featured by Advantest at this year’s SEMICON Japan (December 14-16) in Tokyo. Advantest will showcase both its newest test solutions and its market-proven products. Displays will be organised into four general categories of IoT applications: Industrial, Wireless/Wearables, Connected Homes, and Connected Automobiles.
12th December 2016

Pick and place IC handler enhances manufacturing efficiency

Pick and place IC handler enhances manufacturing efficiency
A pick-and-place handler has been developed by Advantest to improve productivity in testing system-on-chip (SoC) devices in high-volume manufacturing (HVM) and device characterisation pre-production environments. This helps users to keep pace with the rapidly changing SoC market and quickly adapt to changes in device technology.
5th December 2016

electronica 2016: AD-converter tester on parade in Munich

Semiconductor test equipment supplier Advantest will highlight the latest measurement solutions for automotive, communications and consumer devices at electronica in Munich (November 8-11). Show attendees can learn more about Advantest’s EVA100 measurement system for low-pin-count analogue, mixed-signal IC and sensor devices.
3rd November 2016

Order book opens for SiP device test system

Order book opens for SiP device test system
The T2000 AiR, a compact, air-cooled system optimised for low-cost testing in R&D and high-mix, low-volume production is available to order from Advantest. Shipments to customers are expected to begin in the first quarter of calendar year 2017. Global market demand continues to grow for smartphones and other mobile electronic devices as well as consumer and enterprise services offered over the internet.
2nd November 2016

RF test solution headed to SEMICON Europa

A full line of test solutions for automotive, communications and consumer devices together with metrology and advanced E-beam lithography systems will be exhibited by Advantest at SEMICON Europa in Grenoble (October 25-27). Visitors will see the latest product developments for the V93000 platform.
20th October 2016

E-beam lithography system to feature at Vienna show

The F7000 EB (electron beam) lithography system will be the centerepice of Advantest’s stand at the Micro and Nano Engineering Show in Vienna (September 19-23). The system delivers high throughput and creates very accurate and smooth nano-patterns on wafers from 1X-nm resolutions.
19th September 2016

Solid state drive testing shifts to single platform

Solid state drive testing shifts to single platform
 The MPT3000HVM system has been developed by Advantest to provide a single platform to test the full range of SATA, SAS, and PCIe solid-state drives (SSDs), from the highest performance enterprise to the most cost-effective client SSDs. The system achieves this optimal production test solution by leveraging the proven MPT3000 tester-per-DUT (device under test) architecture and unique hardware acceleration in a new high-density configuration.
8th August 2016

Die-level handler tests ICs for high-growth applications

Die-level handler tests ICs for high-growth applications
The HA1000 die-level handler is a cost-efficient test solution for determining known good dies (KGD) prior to IC packaging announced by Advantest. Economics is a driving factor in die-level testing. Determining a semiconductor device’s viability prior to packaging or building memory stacks is critical to avoiding rework, achieving high yields and lowering costs.
1st June 2016

Versatile tester targets wide range of flash memories

The new T5830 memory tester is the latest member of Advantest’s T5800 product family, optimised for testing a wide range of flash memory devices used in mobile electronic devices.  As portable applications are booming, the global market for flash-memory test systems is projected to reach $148 million by 2018, according to market analysis firm VLSIresearch.
29th March 2016

TDR option enhances semiconductor quality analysis

TDR option enhances semiconductor quality analysis
A new TDR Option for Advantest’s TS9000 series of terahertz analysis systems has been released. It enables analysis of circuit quality in semiconductors, printed substrates, electronic components, and other applications, utilising short-pulse terahertz waves.
24th October 2015

Short-pulse terahertz waves technology used for chip circuit analysis

Short-pulse terahertz waves technology used for chip circuit analysis
A technology that utilises short-pulse terahertz waves for analysis of electrical circuits has been developed by Advantest. The technology has 2 major applications – analysis of the transmission characteristics (S parameters) of devices using the sub-terahertz band (100GHz~1THz), and characterisation and location of failures in chip circuits (TDT/TDR).
27th May 2015


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