A two component epoxy system with a low mixed viscosity of 350-700 cps has been introduced by Master Bond. It is a low shrinkage/low exotherm product is well suited for large volume casting applications as well as bonding, coating and sealing.

Master Bond EP29LPHE is a two component epoxy system with a low mixed viscosity of 350-700 cps. This low shrinkage/low exotherm product is particularly well suited for large volume casting applications as well as bonding, coating and sealing. “What sets EP29LPHE apart from other epoxies is that while it cures relatively rigid, it has excellent toughness, provides a low moduls and high elongation, which allows it to withstand shock and impac...

A two component epoxy has been released by Master Bond. The EP45HTAN features thermal conductivity, electrical insulation and a service temperature range of -269.15 to 260°C (4K to 500°F). This high strength system bonds well to metals, particularly to roughened titanium.

Ideal for potting and encapsulation applications, Master Bond's MasterSil 157 is a two component silicone system that features low viscosity and low exotherm. According to the company, it has superior electrical insulation properties and can cure in sections beyond 1 inch thick.

Master Bond Supreme 3HTND-2DM is a rapid curing, toughened, one part epoxy system used for the dam-and-fill method for chip-on-board encapsulation. Essentially, there are two methods to protect chips and their wire bonds. One method is referred to as glob top, where the encapsulating system is dispensed and applied directly to the area to be protected. The dam-and-fill method entails dispensing the damming material around the area to be encapsula...

Master Bond EP41S-5 is a two part epoxy system for bonding, sealing, coating and encapsulating with what the company says is a forgiving 100 to 25 mix ratio by weight. EP41S-5 will cure at room temperature or more rapidly at elevated temperatures. The optimum curing schedule is overnight at 75°F followed by 3-4 hours at 150-200°F. It has exemplary resistance to a wide array of chemicals, especially acids, bases, alcohols, fuels and many s...

Master Bond EP30LP-2 is a two component epoxy with a low viscosity and a volume resistivity of over 1014 ohm/cm, making it well suited for potting and encapsulation applications as well as bonding and sealing. EP30LP-2 is an easy to handle compound with a convenient two to one mix ratio by weight or volume.

Formulated for use in demanding thermal management applications, Master Bond EP30TC is a two component epoxy that contains a robust thermally conductive filler with very fine particle sizes. This NASA low outgassing certified system can be used for bonding, coating, sealing and encapsulating for the aerospace, electronic, optical and OEM industries.

A high-strength fast curing epoxy for use in the assembly of medical devices, the Master Bond EP3HTND-2Med Black, fully meets USP Class VI specifications. This one part system delivers resistance to a variety of sterilisation methods such as chemical sterilants, EtO, radiation and especially autoclaving.

Certified to meet ASTM E595 NASA low outgassing standards, Master Bond EP46HT-2AO Black is well suited for the aerospace, electronic, optoelectronic industries and can be used vacuum environments. This two component system blends thermal stability with a high strength profile for a variety of bonding, sealing and encapsulation applications.

Master Bond X5TC is an elastomeric system that is said to have an excellent thermal conductivity while maintaining solid electrical insulation properties. This one part, no mix adhesive/sealant has a paste-like consistency and is said to be very easy to use. It readily cures in 8-12 hours at room temperature or in 60-90 minutes at 150°F.

Master Bond EP126 is said to excel in high temperature applications up to +600°F. This two component product features what Master Bond says are unique handling properties as Part A is a moderate viscosity liquid and Part B is a powder. It can be easily mixed using a forgiving 100 to 50 ratio by weight. 

Master Bond EP30-2LB blocks UV light from 200-400 nm and allows the transmission of visible light from 450-900 nm. This two part system is optically clear with a refractive index of 1.55. It also passes ASTM E595 testing to meet NASA low outgassing specifications.

Featuring a nickel filler, Master Bond EP21TDCN-LO is an electrically conductive two component adhesive/sealant that is said to be particularly effective for grounding, shielding and static dissipation applications. It is a toughened system and is capable of withstanding rigorous thermal cycling, mechanical vibration and shock.

Formulated for bonding, sealing, coating and encapsulation applications, Master Bond EP41S-5 is a room temperature curing epoxy that combines a high strength profile, superior electrical insulation values and exceptional chemical resistance. This system can be used in the aerospace, electronic, power, chemical processing, specialty OEM and other industries.

Master Bond EP3UF is a one component epoxy that contains thermally conductive fillers with very small particle sizes imparting a low thermal resistance. This low viscosity system has good flow properties and can be applied in bond lines as thin as 10-15 microns.

Master Bond UV22DC80 is a one component, low viscosity, nanosilica filled epoxy based system for bonding, sealing and coating with the ability to cure under UV light and/or with heat. The UV portion of the cure can be achieved in seconds upon exposure to a UV light at 365 nm with 20-40 milliwatts/cm2 of energy. 

According to Master Bond, EP29LPAO is a cost effective, two part system with a low viscosity, excellent flow properties and heat dissipation properties. Featuring convenient processing, this epoxy has a forgiving 100 to 50 mix ratio by weight and a pot life of 7-9 hours at room temperature for a 100 gram mass. 

Master Bond EP3HTS-LO is a single component epoxy for demanding bonding, sealing and coating applications. This system passes ASTM E595 tests for NASA low outgassing, making it well suited for use in the aerospace, electronic, microelectronic and optical industries.

Master Bond EP113 is a nanosilica filled epoxy that is said to deliver enhanced dimensional stability and exceptionally low shrinkage upon curing. This optically clear, two component system is well suited for applications in the aerospace, electronic and OEM industries.