Delivering an array of strength, electrical and handling properties that are well suited for bonding, sealing, coating and encapsulation applications, the EP62-1LPSP epoxy has been introduced by Master Bond. Featuring a tensile lap shear strength of more than 2,000psi, the epoxy bonds well with a variety of substrates including metals, composites, glass and many plastics.

Suitable for bonding, sealing, coating and select casting in electronic, aerospace, optical and speciality OEM applications, Master Bond's EP42HT-2LTE is a two component epoxy with a flowable paste consistency enabling precise alignment with minimal fixturing. It has a low coefficient of thermal expansion of 9-12 x 10-6 in/in/°C and can cure at room temperature (or faster with additional heat).

A one part UV curable adhesive, sealant, coating and potting compound, suitable for bonding dissimilar substrates, has been released by Master Bond. The UV15X-2 combines a high performance physical profile with low shrinkage. The adhesive is particularly suitable for fibre-optic, optical, electronic, microelectronic, semiconductor and laser applications.

Formulated to operate over a wide temperature range of -62 to +343°C, Master Bond EP17HT-LO is a one part epoxy for bonding, sealing, coating and encapsulation. The low viscosity system has very low exotherm upon curing and can be cast in sections up to 0.5" in thickness. EP17HT-LO offers convenient handling, requires no mixing and has an unlimited working life at room temperature.

A one component epoxy system, which is designed for die attach applications, has been released by Master Bond. Offering an unlimited working life at room temperature, the Master Bond Supreme 3HTND-2DA cures in 5-10 minutes at 150°C. The adhesive, which performed well in 85/85 testing, has a die shear strength of 19-21kg-f.

Resistant to temperatures up to 260°C, the 12AOHT-LO epoxy is now available from Master Bond. Offering thermal conductivity of 9-10 BTU•in/ft2•hr•°F, the one component epoxy has passed ASTM E595 testing for NASA low outgassing and is well suited for vacuum environments. The epoxy can also be used for a range of bonding and sealing applications in the electronic, aerospace, OEM and electro-optic industries.

Suited for bonding, sealing, coating and encapsulation applications in the medical device industry, Master Bond's EP21AOLV-2Med is a two component epoxy system. The thermally conductive and electrically isolating epoxy withstands a variety of sterilisation methods, including EtO, radiation and many cold sterilants.

Able to resist EtO and gamma sterilisation processes, the Master Bond MB250NT targets a variety of applications ranging from repair to high speed production for disposable/reusable medical devices. ISO 10993-5 certified, the single component ethyl cyanoacrylate cures rapidly depending upon the atmospheric humidity. This means the higher the level, the faster the rate of cure.

Curing in just 1-2 minutes at 149°C (300°F), the EP3SP5FL single component epoxy has been released by Master Bond. Suitable for a variety of applications in the electronic, aerospace and OEM industries, the manufacturer has stated that since it requires heat curing, it has an essentially  'unlimited' working life at room temperature.

  Master Bond has published an easy to read, 28 page catalogue which details the performance and processing data of its range of epoxies, silicones, UV curing compounds and speciality systems for the aerospace industry.

A coating system for EMI/RFI applications, claimed to be high performing, has been developed by Master Bond. MB600G is a water-based, sodium silicate system with graphite filler, making it suitable for shielding applications such as those within the electronics and aerospace industries.

Master Bond EP112LS is a two part epoxy that is well suited for impregnation, potting, encapsulation, sealing and coating applications, particularly in the aerospace and optoelectronics industries. EP112LS is optically clear, features reliable non-yellowing properties and has a refractive index of 1.55.

Master Bond EP46HT-1AO is formulated for bonding and sealing applications, is widely used in the aerospace, electronic and specialty OEM industries. Unlike most conventional two component epoxies, EP46HT-1AO cures with the addition of heat, which allows it to have a working life exceeding 24 hours. It has a forgiving 100 to 30 mix ratio by weight and bonds well to metals, composites, glass, ceramics and many plastics.

MasterSil 152, a two component condensation curing system from Master Bond, has been developed for potting and encapsulation applications where an addition cured silicone cannot be used. Only requiring air for complete cross-linking, the curing system has no ubstrates that will inhibit the cure. 

A UV curable system for bonding, sealing and coating applications, designated the UV15-42C, has been launched by Master Bond. Specially formulated to optimize bond strength, the smooth paste can be applied vertically without sagging. As an optically clear compound, it is often used in the fiber-optic, optical, electronic, aerospace and specialty OEM industries.

Widely used in the manufacture of disposable medical devices, Master Bond's LED403Med is a single component system that passes the plastics test for USP Class VI and ISO 10993-5 cytotoxicity requirements. This medical grade system withstands sterilization methods such as gamma radiation, EtO and various chemical sterilants.

Delivering abrasion resistance for an array of chemical and mechanical processing applications, the EP21SC-1 is a 2 component epoxy from Master Bond.

Master Bond LED401 is a breakthrough system based on LED technology. This adhesive, sealant, coating and encapsulant cures tack-free upon exposure to a 405 nm wavelength light source, without any oxygen inhibition. Optically clear, it is also safer and easier to handle than similar UV systems as LED lights emit substantially less heat than UV lamps. This makes LED401 a suitable choice for applications involving heat sensitive substrates.

With its outstanding light transmission properties and optical clarity, Master Bond UV15 is widely used for a variety of bonding, coating and sealing applications in the optical, electronic and optoelectronic industries. This epoxy based UV curable system is 100% reactive and does not contain any solvents or other volatiles. It is also completely free of any oxygen inhibition.

Ideal for potting and encapsulation applications, Master Bond EP21LV features a low viscosity and outstanding electrical insulation properties. It is broadly used in the medical and food industries, as it conforms to USP Class VI and Title 21, U.S. Code of Federal Regulations, FDA Chapter 1, Section 175.105 requirements.